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Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Hardcover - 9783319076102 Der Gesetzgeber sieht also zwei

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Der Gesetzgeber sieht also zwei wesentliche Motive mittelständischer Unternehmen die Rechtsform der Aktiengesellschaft zu wählen: kurz- bis langfristig [¿]

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Essay from the year 2013 in the subject History - Asia

Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Hardcover - 9783319076102 Der Gesetzgeber sieht also zweiThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for

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